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Electronics packaging includes packaging for chips, electronic components, electronic systems, electrical conductors or insulators and other equipment.

Materials that are mostly used for electronics packaging are: polymers, fibers, photopolymers, dispersions, coatings and film making.


Two types of "chips" are available currently.
They are:

• IC chips
• potato chips. 

Packaging for chips used to be consisted of multiple layers. These layers are:

• protective coating,
• vacuum deposited aluminium,
• polyester,
• adhesive,
• static dissipative wash coating.

The types of electronics packaging are as follow:

• Magazines (Slides,Tubes, Rails)
  
• Bags and Pouches (Non-Cushioning)
  
• Flexible Cushioning Materials (Open Cellular and Closed Cellular Foams and Other Types in Sheet, Roll, Pouch, or Bag Form)
• Chipboard Cartons, Corrugated Boxes, and Other Similar Non-Flexible Containers Other Than Magazines
• Loose Fill, Small Molded, and Irregular Shaped Materials
• Rigid Foams, Large Molded, and Other Similar Materials
• Carrier Foam, Lead Insertion Foam